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GP1S196HCZ0F/GP1S196HCZSF
GP1S196HCZ0F GP1S196HCZSF
Gap : 1.1mm, Slit : 0.3mm Phototransistor Output, Compact Transmissive Photointerrupter
Description
GP1S196HCZ0F is a compact-package, photo-transistor output, transmissive photointerrupter, with opposing emitter and detector in a molding that provides noncontact sensing. The compact package series is a result of unique technology combing transfer and injection molding. This device is half the size of the rest of the parts in this family.
Agency approvals/Compliance
1. Compliant with RoHS directive
Applications
1. General purpose detection of object presence or motion. 2. Example : printer, lens control for camera
Features
1. Transmissive with phototransistor output 2. Highlights : * Compact Size * Low Profile * Narrow Gap * Through-hole : GP1S196HCZ0F * SMT : GP1S196HCZSF 3. Key Parameters : * Gap Width : 1.1mm * Slit Width (detector side): 0.3mm * Package : 3.1x2x2.7mm 4. Lead free and RoHS directive compliant
Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
1
Sheet No.: D3-A01001EN Date Jun. 30. 2005 (c) SHARP Corporation
GP1S196HCZ0F/GP1S196HCZSF
Internal Connection Diagram
Top view
2 1 1 2 3 4 3 4
Anode Collector Emitter Cathode
Outline Dimensions
Through-Hole [GP1S196HCZ0F]
2-(0.3) 2-(0.7) Top view a
(Unit : mm) SMT Gullwing Lead-Form [GP1S196HCZ0F]
2-(0.3) 2-(0.7) 2-(1.62) 2-(1.5) 2-(1.75) a-a section
G at e
Top view a 2
(R 0. 2)
a' 3.1 1.1
0. 2)
4-
2-(1.5) 2-(1.75)
a-a section
G at e
4-
(R
2-(1.62)
a' 3.1
2.7
2.7
(0.3) Slit width (1.2)
2
1.1
(0.3) Slit width (1.2)
n tio si po
n tio si po
2.1
(0.04)
2.1
Identification mark
2 2-(0.85) (2.15) (1.05)
3
4-0.15
2-1.70.3
4-0.3 1.3
2-1.50.3
(0.75) Center of light path
0.1
2-(0.85)
4 0.
Identification mark
3.20.2
(0.75) Center of light path
4-0.3 1.3
4 0.
(2.15) (1.05)
3 4
Same potential as 1
4
Same potential as 1
2-(0.2)
2
1
2-(0.2)
2
1
Same potential as
3
2-1.85
3
Same potential as
* Unspecified tolerance : 0.1mm. * Dimensions in parenthesis are shown for reference. * The dimensions indicated by refer to those measured from the lead base. * The dimensions shown do not include those of burrs. Burr's dimensions : 0.15mm MAX. * The lead may be exposed at the painting out portion. * There is agreer identification mark on he light emitting side.
* Unspecified tolerance : 0.1mm. * Dimensions in parenthesis are shown for reference. * The dimensions indicated by refer to those measured lead plating portion. * The dimensions shown do not include those of burrs. Burr's dimensions : 0.15mm MAX. * The lead may be exposed at the painting out portion. * There is agreer identification mark on he light emitting side.
Product mass : approx. 0.022g
Product mass : approx. 0.02g Plating material : SnCu (Cu : TYP. 2%)
Country of origin
Japan
Sheet No.: D3-A01001EN
2
GP1S196HCZ0F/GP1S196HCZSF
Absolute Maximum Ratings
Parameter Forward current Input Reverse voltage Power dissipation Collector-emitter voltage Emitter-collector voltage Output Collector current Collector power dissipation Total power dissipation Operating temperature Storage temperature 1 Soldering temperature
Symbol Rating IF 30 VR 6 P 75 VCEO 35 VECO 6 IC 20 75 PC 100 Ptot Topr -25 to +85 Tstg -40 to +100 Tsol 260
(Ta=25C ) Unit mA V mW V V mA mW mW C C C
0.3mm or more Soldering area
(GP1S196HCZ0F)
1 For 3s or less
Electro-optical Characteristics
Parameter Forward voltage Input Reverse current Output Collector dark current Collector current Transfer Collector-emitter saturation voltage characRise time teristics Response time Fall time Symbol VF IR ICEO IC VCE(sat) tr tf Condition IF=20mA VR=3V VCE=20V VCE=5V, IF=5mA IF=10mA, IC=40A VCE=5V, IC=100A, RL=1k MIN. - - - 100 - - - TYP. 1.2 - - - - 50 50
(Ta=25C ) MAX. Unit 1.4 V 10 A 100 nA 400 A 0.4 V 150 s 150
Sheet No.: D3-A01001EN
3
GP1S196HCZ0F/GP1S196HCZSF
Fig.1 Forward Current vs. Ambient Temperature
60 50 Forward current IF (mA) 40 30 20 10 0 25 0 25 50 75 85 100 Ambient temperature Ta (C)
Fig.2 Power Dissipation vs. Ambient Temperature
120 100 80 75 60 40 20 15 0 -25 0 25 50 75 85 100 Ptot
Power dissipation P, Pc, Ptot (mW)
P,Pc
Ambient temperature Ta (C)
Fig.3 Forward Current vs. Forward Voltage
100
Fig.4 Collector Current vs. Forward Current
1.1 1 0.9 Collector current IC (mA) VCE=5V Ta=25C
Forward current IF (mA)
0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0
10
Ta=85C 65C 45C 25C 0C -25C
1 0 0.5 1 1.5 2 Forward voltage VF (V)
0
2
4
6
8
10
12
14
16
18
20
Forward current IF (mA)
Fig.5 Collector Current vs. Collectoremitter Voltage
2 Ta 25C IF 30mA
Fig.6 Relative Collector Current vs. Ambient Temperature
130 120 110 Relative collector current (%) 100 90 80 70 60 50 40 30 20 10 0 -25 IF=5mA VCE=5V IC=100% at Ta=25C
1.6 Collector current IC (mA)
1.2
20mA
0.8 10mA 0.4
5mA
0 0 2 4 6 8 10 Collector-emitter voltage VCE (V)
0
25
50
75
Ambient temperature Ta (C)
Sheet No.: D3-A01001EN
4
GP1S196HCZ0F/GP1S196HCZSF
Fig.7 Collector-emitter Saturation Votage vs. Ambient Temperature
Collector-emitter saturation voltage VCE (sat) (V) 0.2 0.18 0.16 0.14 0.12 0.1 0.08 0.06 0.04 -25 0 25 50 75 IF=10mA IC=40A
Fig.8 Collector Dark Current vs. Ambient Temperature
10
6
VCE 20V
Collector dark current ICEO (A)
10
7
10
8
10
9
10
10
0
25
50
75
100
Ambient temperature Ta (C)
Ambient temperature Ta (C)
Fig.9 Response Time vs. Load Resistance
1 000 VCE=5V IC=100A Ta=25C tr
Fig.10 Test Circuit for Response Time
VCC RD Input RL Output Input Output 10% 90%
Response time (s)
100
tf td ts
td tr
ts tf
10
1 0.1
1 10 Load resistance RL (k)
100
Fig.11 Relative Collector Current vs. Shield Distance (1)
100 90 Relative collector current (%) 80 70 60 50 40 30 20 10 0 0 IF=5mA VCE=5V 0.5 1 1.5 2 0 L
Fig.12 Relative Collector Current vs. Shield Distance (1)
100 90 Relative collector current (%) 80 70 60 50 40 30 20 10 0 0 IF=5mA VCE=5V 0.5 1 1.5 2 L 0 Shield moving distance L (mm)
Sheet No.: D3-A01001EN
Shield moving distance L (mm)
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
5
GP1S196HCZ0F/GP1S196HCZSF
Design Considerations Design guide
1) Prevention of detection error To prevent photointerrupter from faulty operation caused by external light, do not set the detecting face to the external light. 2) Position of opaque board Opaque board shall be installed at place 1.4mm or more from the top of elements. (Example)
1.4mm or more
1.4mm or more
This product is not designed against irradiation and incorporates non-coherent IRED.
Degradation
In general, the emission of the IRED used in photointerrupter will degrade over time. In the case of long term operation, please take the general IRED degradation (50% degradation over 5 years) into the design consideration.
Recommended Foot Print (Only for GP1S196HCZSF)
3.7 1.65
1.3
0.7
0.6
Sheet No.: D3-A01001EN
6
GP1S196HCZ0F/GP1S196HCZSF
Parts
This product is assembled using the below parts.
* Photodetector (qty. : 1)
Category Phototransistor Material Silicon (Si) Maximum Sensitivity wavelength (nm) 930 Sensitivity wavelength (nm) 700 to 1 200 Response time (s) 20
* Photo emitter (qty. : 1)
Category Infrared emitting diode (non-coherent) Material Gallium arsenide (GaAs) Maximum light emitting wavelength (nm) 950 I/O Frequency (MHz) 0.3
* Material
Case Black polyphernylene sulfide resin (UL94 V-0) Lead frame 42Alloy Lead frame plating SnCu plating
Sheet No.: D3-A01001EN
7
GP1S196HCZ0F/GP1S196HCZSF
Manufacturing Guidelines Storage and management after open (Only for GP1S196HCZSF) Storage condition
Storage temp.: 5 to 30C, Storage humidity : 70%RH or less at regular packaging.
Treatment after opening the moisture-proof package
After opening, you should mount the products while keeping them on the condition of 5 to 25C and 70%RH or less in humidity within 4 days. After opening the bag once even if the prolonged storage is necessary, you should mount the products within two weeks. And when you store the rest of products you should put into a DRY BOX. Otherwise after the rest of products and silicagel are sealed up again, you should keep them under the condition of 5 to 30C and 70%RH or less in humidity.
Baking before mounting
When the above-mentioned storage method could not be executed, please process the baking treatment before mounting the products. However the baking treatment is permitted within one time. Recommended condition : 125C, 16 to 24 hours Do not process the baking treatment with the product wrapped. When the baking treatment processing, you should move the products to a metallic tray or fix temporarily the products to substrate.
Soldering Method Reflow Soldering (Only for GP1S196HCZSF) :
Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please solder within one time.
MAX 240C 1 to 4C/s 200C
MAX 160C
1 to 4C/s
1 to 4C/s
25C MAX10s MAX120s MAX60s MAX90s
Sheet No.: D3-A01001EN
8
GP1S196HCZ0F/GP1S196HCZSF
Flow Soldering:
Soldering should be completed below 260C and within 3 s. Please solder within one time. Soldering area is 0.3mm or more away from the bottom of housing. Please take care not to let any external force exert on lead pins. Please don't do soldering with preheating, and please don't do soldering by reflow.
Other notice
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the cooling and soldering conditions.
Cleaning instructions Solvent cleaning :
Solvent temperature should be 45C or below. Immersion time should be 3 minutes or less.
Ultrasonic cleaning :
Do not execute ultrasonic cleaning.
Recommended solvent materials :
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol.
Presence of ODC
This product shall not contain the following materials. And they are not used in the production process for this product. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC). *Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE).
Sheet No.: D3-A01001EN
9
GP1S196HCZ0F/GP1S196HCZSF
Package specification Sleeve package 1. Through-hole (GP1S196HCZ0F) Package materials
Sleeve : Polycarbonate Stopper : Styrene-Elastomer
Package method
MAX. 200 pcs. of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. MAX. 50 sleeves in one case.
2. SMT Gullwing (GP1S196HCZSF) Package materials
Sleeve : Polycarbonate Stopper : Styrene-Elastomer Aluminium laminated Bag : Nylon, Polyphernylene, Aluminium
Package method
MAX. 200 pcs. of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. MAX. 50 sleeves with silicagel are enclosed in aluminium laminated bag. After sealing up the bag, it encased in one case.
Sheet No.: D3-A01001EN
10
GP1S196HCZ0F/GP1S196HCZSF
Important Notices
* The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. * Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. * Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). * If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. * This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. * Contact and consult with a SHARP representative if there are any questions about the contents of this publication.
[H135]
Sheet No.: D3-A01001EN
11

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